The capacity of Module Assemblage is 120M units per year. Such huge capacity is not only used for Hengbao card production, but also has been used for many business partners, for example the fabless Chip Design-houses and Card Factories which has no such ability.

Hengbao production capability covers the whole process of card making, including the Module Assemblage, which is the most difficult and most technological advanced in all production stages. Many card providers just outsource their Module Assemblage stages to other professional factories, while Hengbao factory covers not only Card Embedding and Personalization, but also Module Assemblage. Covering 1200 sq. m., the assemblage workshop contains six complete Module Assemblage Lines, which equipped by the most advanced and first level equipments. The engineers, trained in Germany, have solid production management experiences.

The aim of Module Assemblage is to capsulate the Chip Wafer and Micro-connector to make Module. In such stage, Tapes, Bonding Wires and Molds are used very elaborately to connect Wafer to embeddable Modules.


Hengbao Module Assemblage is equipped the most advanced machines, some of which is list as below.